This work presents the fabrication process of innovative semiconductor junction and analysis of its performances. This application is an exploitation of intelligent materials to obtain transparency and flexibility characteristics. Many delicate operations are encountered during preparation of the film especially chemical deposition by evaporation, exposition to radiations and baking inside a specific oven. The physical phase quality is very promising for development of nanotechnology smart components. Thereon, we make adequate choices of additives materials during preparation. The band gap is a defiance that we are reducing to ameliorate precisely the impedance and thickness. The fabricated junction is then tested to ensure its stabilization and its bearing for temperature variations. It is very important as esthetic side for smart devices to get high quality for optical properties in parallel with electrical ones. We study evolutions of many parameters such as electrical impedance in function of temperature and optical reflection coefficient.
Volume 11 | 11-Special Issue
Pages: 641-647
DOI: 10.5373/JARDCS/V11SP11/20193078